- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
- Metal-based compound containing metal oxide
- Thermal conductivity of more than 1.93 W/m-K
- Negligible electrical conductivity
- Stable performance over a wide temperature range
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.